Description
The NCP303150DMNTWG integrates a MOSFET driver, high−side MOSFET
and low−side MOSFET into a single package.
The driver and MOSFETs have been optimized for high−current
DC−DC buck power conversion applications. The NCP303150
integrated solution greatly reduces package parasitics and board space
compared to a discrete component solution.

Features
Capable of Average Currents up to 50 A
30 V / 30 V Breakdown Voltage MOSFETs for Higher Long Term

Reliability
High−Performance, Universal Footprint, Copper−Clip 5 mm x 6 mm
PQFN Package
Capable of Switching at Frequencies up to 1 MHz
Compatible with 3.3 V or 5 V PWM Input
Responds Properly to 3−level PWM Inputs
Precise Current Monitoring
Option for Zero Cross Detection with 3−level PWM
Internal Bootstrap Diode
Catastrophic Fault Detection
Thermal Flag (OTP) for Over−Temperature Condition
Over−Current Protection FAULT (OCP)
Under−Voltage Lockout (UVLO) on VCC and PVCC
Supports Intel® Power State 4

Applications
Desktop & Notebook Microprocessors
Graphic Cards
Routers and Switches